In 2025, the company continued to deepen its presence in core application areas such as Automotive electronics, Computing and communications, achieving significant breakthroughs in technical capabilities. It made new progress in technologies including 50 μm/50 μm fine lines, X-type vias in HDI processes, 12-layer any-layer technology, deep microvias, hybrid lamination, 20:1 aspect ratio, etch‑back backdrilling, raised‑pad copper‑aluminum composite substrates, special sandwich copper‑core substrates, and embedded ceramic substrates.In the automotive electronics sector, products such as ADAS domain controllers, semi‑flex circuits for chassis‑by‑wire systems, millimeter‑wave radar (featuring high‑frequency hybrid lamination and waveguide antennas), LiDAR, and LED automotive headlights (based on low‑modulus raised‑pad copper substrates) have undergone continuous iterative upgrades.In computing and communications, the company steadily enhanced its technical capabilities for telecommunications and data center products, and continuously optimized key offerings including Whitley and Eagle Stream platform servers, SSDs, smart NICs, PCIe (PLCe) cards, and embedded copper‑coin TRX modules.